Photoveel II Machinable Ceramic Material
Photoveel II series materials feature a fine grain structure with excellent mechanical properties that enable precision features, high hole density, and hole diameters down to 30µm. Best of all, Photoveel II is available in a wide range of CTEs (coefficient of thermal expansion).
Applications
- Various inspection parts
- Insulation parts with micro structure
- Lens holder (low reflectance)
Properties
Photoveel II | Photoveel II-S | Photoveel II-K70 | |||
---|---|---|---|---|---|
General properties | Characteristics | High strength | High strength | High strength High thermal conductivity |
|
Main component purity (wt%) | – | – | – | ||
Color | Light gray | Light gray/black | Light gray | ||
Density (g/cm3) | 2.56 | 3.5 | 2.7 | ||
Water absorption (%) | 0 | 0 | 0 | ||
Mechanical properties | Bending strength (MPa) | 440 | 320 | 520 | |
Young’s modulus (GPa) | 157 | 130 | 200 | ||
Vickers hardness (GPa) | 2.3 | 2.3 | 4 | ||
Thermal properties | Max. operating temperature (°C) | 1000 (In nonoxidizing atmosphere) |
1000 (In nonoxidizing atmosphere) |
1000 (In nonoxidizing atmosphere) |
|
Coefficient of thermal expansion (1/°C×10-6) | 1.4 (RT~150°C) | 4.7 (RT~150°C) | 1.0 (RT~150°C) | ||
Coefficient of thermal conductivity (W/m×K) | 50 | 23 | 70 | ||
Thermal shock resistance ΔT (°C) | 600 | 400 | – | ||
Electrical properties | Volume resistivity | 25°C | 1015 | 1015 | 1015 |
300°C | – | – | – | ||
500°C | – | – | – | ||
800°C | – | – | – | ||
Dielectric constant | 10GHz | 5.5 | 9 | 5.9 | |
Dielectric loss (×10-4) | 10 | 25/16 | 11 | ||
Q factor (×104) | 0.1 | 0.04/0.06 | 0.09 | ||
Dielectric breakdown voltage (KV/mm) | 35 | 30/>20 | 18 |