Photoveel II Machinable Ceramic Material

Photoveel II series materials feature a fine grain structure with excellent mechanical properties that enable precision features, high hole density, and hole diameters down to 30µm. Best of all, Photoveel II is available in a wide range of CTEs (coefficient of thermal expansion).

Applications

  • Various inspection parts
  • Insulation parts with micro structure
  • Lens holder (low reflectance)
Photoveel II Products Photo Photoveel II Products Photo

Properties

Photoveel II Photoveel II-S Photoveel II-K70
General properties Characteristics High strength High strength High strength
High thermal conductivity
Main component purity (wt%)
Color Light gray Light gray/black Light gray
Density (g/cm3) 2.56 3.5 2.7
Water absorption (%) 0 0 0
Mechanical properties Bending strength (MPa) 440 320 520
Young’s modulus (GPa) 157 130 200
Vickers hardness (GPa) 2.3 2.3 4
Thermal properties Max. operating temperature (°C) 1000
(In nonoxidizing atmosphere)
1000
(In nonoxidizing atmosphere)
1000
(In nonoxidizing atmosphere)
Coefficient of thermal expansion (1/°C×10-6) 1.4 (RT~150°C) 4.7 (RT~150°C) 1.0 (RT~150°C)
Coefficient of thermal conductivity (W/m×K) 50 23 70
Thermal shock resistance ΔT (°C) 600 400
Electrical properties Volume resistivity 25°C 1015 1015 1015
300°C
500°C
800°C
Dielectric constant 10GHz 5.5 9 5.9
Dielectric loss (×10-4) 10 25/16 11
Q factor (×104) 0.1 0.04/0.06 0.09
Dielectric breakdown voltage (KV/mm) 35 30/>20 18