Photoveel II Machinable Ceramic Material

Photoveel II series materials feature a fine grain structure with excellent mechanical properties that enable precision features, high hole density, and hole diameters down to 30µm. Best of all, Photoveel II is available in a wide range of CTEs (coefficient of thermal expansion).

Applications

  • Various inspection parts
  • Insulation parts with micro structure
  • Lens holder (low reflectance)
Photoveel II Products Photo Photoveel II Products Photo

Properties

Photoveel IIPhotoveel II-SPhotoveel II-K70
General propertiesCharacteristicsHigh strengthHigh strengthHigh strength
High thermal conductivity
Main component purity (wt%)
ColorLight grayLight gray/blackLight gray
Density (g/cm3)2.563.52.7
Water absorption (%)000
Mechanical propertiesBending strength (MPa)440320520
Young’s modulus (GPa)157130200
Vickers hardness (GPa)2.32.34
Thermal propertiesMax. operating temperature (°C)1000
(In nonoxidizing atmosphere)
1000
(In nonoxidizing atmosphere)
1000
(In nonoxidizing atmosphere)
Coefficient of thermal expansion (1/°C×10-6)1.4 (RT~150°C)4.7 (RT~150°C)1.0 (RT~150°C)
Coefficient of thermal conductivity (W/m×K)502370
Thermal shock resistance ΔT (°C)600400
Electrical propertiesVolume resistivity25°C101510151015
300°C
500°C
800°C
Dielectric constant10GHz5.595.9
Dielectric loss (×10-4)1025/1611
Q factor (×104)0.10.04/0.060.09
Dielectric breakdown voltage (KV/mm)3530/>2018