Aluminum Nitride Ceramic Material

Aluminium Nitride is frequently selected for its thermal conductivity and its resistance to attack by fluorine plasmas.

Applications

  • Chamber parts for semiconductor process equipment
  • Heat radiation substrate

Silicon Nitride Ceramics Products Photo

Properties

ALN99ALN94
General propertiesCharacteristicsHigh purityHigh thermal conductivity
Main component purity (wt%)9994
ColorLight grayLight gray
Density (g/cm3)3.243.31
Water absorption (%)00
Mechanical propertiesBending strength (MPa)295345
Young’s modulus (GPa)320320
Vickers hardness (GPa)1111
Thermal propertiesMax. operating temperature (°C)10001000
Coefficient of thermal expansion (1/°C×10-6)RT~500°C4.44.4
RT~800°C5.15.1
Coefficient of thermal conductivity (W/m×K)80150
Thermal shock resistance ΔT (°C)300400
Electrical propertiesVolume resistivity25°C10141014
300°C1081010
500°C107107
800°C105105
Dielectric constant10GHz8.58.5
Dielectric loss (×10-4)3030
Q factor (×104)0.030.03
Dielectric breakdown voltage (KV/mm)

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